205 lines
4.4 KiB
Plaintext
205 lines
4.4 KiB
Plaintext
{
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"Header": {
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"GenerationSoftware": {
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"Vendor": "KiCad",
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"Application": "Pcbnew",
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"Version": "9.0.0"
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},
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"CreationDate": "2025-03-25T19:49:10+01:00"
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},
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"GeneralSpecs": {
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"ProjectId": {
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"Name": "raumtemp_relay",
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"GUID": "7261756d-7465-46d7-905f-72656c61792e",
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"Revision": "rev?"
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},
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"Size": {
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"X": 48.75,
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"Y": 45.45
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},
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"LayerNumber": 6,
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"BoardThickness": 0.23,
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"Finish": "None"
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},
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"DesignRules": [
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{
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"Layers": "Outer",
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"PadToPad": 0.15,
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"PadToTrack": 0.15,
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"TrackToTrack": 0.15,
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"MinLineWidth": 0.15,
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"TrackToRegion": 0.2,
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"RegionToRegion": 0.2
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},
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{
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"Layers": "Inner",
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"PadToPad": 0.15,
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"PadToTrack": 0.15,
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"TrackToTrack": 0.15,
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"MinLineWidth": 0.2,
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"TrackToRegion": 0.2,
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"RegionToRegion": 0.2
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}
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],
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"FilesAttributes": [
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{
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"Path": "raumtemp_relay-F_Cu.gbr",
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"FileFunction": "Copper,L1,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "raumtemp_relay-In1_Cu.gbr",
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"FileFunction": "Copper,L5,Inr",
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"FilePolarity": "Positive"
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},
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{
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"Path": "raumtemp_relay-In2_Cu.gbr",
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"FileFunction": "Copper,L7,Inr",
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"FilePolarity": "Positive"
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},
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{
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"Path": "raumtemp_relay-In3_Cu.gbr",
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"FileFunction": "Copper,L9,Inr",
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"FilePolarity": "Positive"
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},
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{
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"Path": "raumtemp_relay-In4_Cu.gbr",
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"FileFunction": "Copper,L11,Inr",
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"FilePolarity": "Positive"
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},
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{
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"Path": "raumtemp_relay-B_Cu.gbr",
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"FileFunction": "Copper,L6,Bot",
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"FilePolarity": "Positive"
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},
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{
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"Path": "raumtemp_relay-F_Paste.gbr",
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"FileFunction": "SolderPaste,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "raumtemp_relay-B_Paste.gbr",
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"FileFunction": "SolderPaste,Bot",
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"FilePolarity": "Positive"
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},
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{
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"Path": "raumtemp_relay-F_Silkscreen.gbr",
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"FileFunction": "Legend,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "raumtemp_relay-B_Silkscreen.gbr",
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"FileFunction": "Legend,Bot",
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"FilePolarity": "Positive"
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},
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{
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"Path": "raumtemp_relay-F_Mask.gbr",
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"FileFunction": "SolderMask,Top",
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"FilePolarity": "Negative"
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},
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{
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"Path": "raumtemp_relay-B_Mask.gbr",
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"FileFunction": "SolderMask,Bot",
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"FilePolarity": "Negative"
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},
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{
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"Path": "raumtemp_relay-Edge_Cuts.gbr",
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"FileFunction": "Profile",
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"FilePolarity": "Positive"
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}
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],
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"MaterialStackup": [
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{
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"Type": "Legend",
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"Name": "Top Silk Screen"
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},
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{
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"Type": "SolderPaste",
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"Name": "Top Solder Paste"
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},
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{
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"Type": "SolderMask",
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"Thickness": 0.01,
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"Name": "Top Solder Mask"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "F.Cu"
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},
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{
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"Type": "Dielectric",
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"Thickness": 0.0,
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"Material": "FR4",
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"Name": "F.Cu/In1.Cu",
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"Notes": "Type: dielectric layer 1 (from F.Cu to In1.Cu)"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "In1.Cu"
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},
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{
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"Type": "Dielectric",
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"Thickness": 0.0,
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"Material": "FR4",
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"Name": "In1.Cu/In2.Cu",
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"Notes": "Type: dielectric layer 2 (from In1.Cu to In2.Cu)"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "In2.Cu"
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},
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{
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"Type": "Dielectric",
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"Thickness": 0.0,
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"Material": "FR4",
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"Name": "In2.Cu/In3.Cu",
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"Notes": "Type: dielectric layer 3 (from In2.Cu to In3.Cu)"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "In3.Cu"
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},
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{
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"Type": "Dielectric",
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"Thickness": 0.0,
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"Material": "FR4",
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"Name": "In3.Cu/In4.Cu",
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"Notes": "Type: dielectric layer 4 (from In3.Cu to In4.Cu)"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "In4.Cu"
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},
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{
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"Type": "Dielectric",
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"Thickness": 0.0,
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"Material": "FR4",
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"Name": "In4.Cu/B.Cu",
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"Notes": "Type: dielectric layer 5 (from In4.Cu to B.Cu)"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "B.Cu"
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},
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{
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"Type": "SolderMask",
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"Thickness": 0.01,
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"Name": "Bottom Solder Mask"
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},
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{
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"Type": "SolderPaste",
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"Name": "Bottom Solder Paste"
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},
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{
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"Type": "Legend",
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"Name": "Bottom Silk Screen"
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}
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]
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}
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